7 Patents
- US122374162025Cut-fin Isolation Regions and Method Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121320502024Semiconductor Structure Cutting Process and Structures Formed Thereby
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US120276082024Semiconductor Structure Having Dielectric Structure Extending Into Second Cavity of Semiconductor Fin
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US119964662024Semiconductor Device and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118943702024Semiconductor Structure Cutting Process and Structures Formed Thereby
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites