Patents/Inventors

Shankar Devasenathipathy

Tempe, AZUS9 patents

9 Patents

US122665892025
Enhanced Base Die Heat Path Using Through-silicon Vias
Intel Corporation
0 cites
US120573692024
Enhanced Base Die Heat Path Using Through-silicon Vias
Intel Corporation
0 cites
US119232682024
Printed Heat Spreader Structures and Methods of Providing Same
Intel Corporation
0 cites
US119012622024
Cooling Solution Including Microchannel Arrays and Methods of Forming the Same
Intel Corporation
0 cites
US118549312023
Stim/liquid Metal Filled Laser Drill Trench to Improve Cooling of Stacked Bottom Die
Intel Corporation
0 cites
US118549352023
Enhanced Base Die Heat Path Using Through-silicon Vias
Intel Corporation
0 cites
US116794072023
Liquid Metal Thermal Interface Material Application
Intel Corporation
0 cites
US116462442023
Socket Loading Mechanism for Passive or Active Socket and Package Cooling
Intel Corporation
0 cites
US115816712023
Integrated Circuit Package Socket Housing to Enhance Package Cooling
Intel Corporation
0 cites