Patents/Inventors

Shang-ying Tsai

PingzhenTW14 patents

14 Patents

US124972852025
Stopper Bump Structures for MEMS Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124128632025
Die Attached Leveling Control by Metal Stopper Bumps
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123587832025
Wire-bond Damper for Shock Absorption
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123227222025
Die Attached Leveling Control by Metal Stopper Bumps
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123038882025
Method to Produce Chemical Pattern in Micro-fluidic Structure
ILLUMINA, Inc.
0 cites
US121911852025
Vacuum Wafer Chuck for Manufacturing Semiconductor Devices
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US119935102024
Composite Spring Structure to Reinforce Mechanical Robustness of a MEMS Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119874942024
Wire-bond Damper for Shock Absorption
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119233312024
Die Attached Leveling Control by Metal Stopper Bumps
0 cites
US117659752023
Thermocouple Device
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US117132422023
MEMS Device with Dummy-area Utilization for Pressure Enhancement
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116613332023
Semiconductor Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US115912112023
Semiconductive Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US115421512023
MEMS Apparatus with Anti-stiction Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites