19 Patents
- US125327752026Methods and Assemblies for Measurement and Prediction of Package and Die Strength
Micron Technology, Inc.
0 cites - US123411102025Methods and Apparatus for Using Structural Elements to Improve Drop/shock Resilience in Semiconductor Devices
Micron Technology, Inc.
0 cites - 0 cites
- US122118142025Semiconductor Interconnect Structures with Conductive Elements, and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US122118222025Stacked Semiconductor Die Assemblies with Substrate Heat Sinks and Associated Systems and Methods
Micron Technology, Inc.
0 cites - 0 cites
- US119844402024Semiconductor Devices, Semiconductor Device Packages, Electronic Systems Including Same, and Related Methods
Micron Technology, Inc.
0 cites - US118698622024Microelectronic Components Including Metal Pillars Secured to Bond Pads, and Related Methods, Assemblies, and Systems
Micron Technology, Inc.
0 cites - US118550022023Warpage Control in Microelectronic Packages, and Related Assemblies and Methods
Micron Technology, Inc.
0 cites - 0 cites
- US117697522023Stacked Semiconductor Die Assemblies with Substrate Heat Sinks and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US117283072023Semiconductor Interconnect Structures with Conductive Elements, and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US117216582023Semiconductor Device Packages with Angled Pillars for Decreasing Stress
Micron Technology, Inc.
0 cites - 0 cites
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- US115879182023Semiconductor Devices, Semiconductor Device Packages, Electronic Systems Including Same, and Related Methods
Micron Technology, Inc.
0 cites - 0 cites