Patents/Inventors

Seunghyun Baik

SeoulKR2 patents

3 Patents

US123623182025
Semiconductor Package Comprising Semiconductor Chip with Stepped Portion
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119489132024
Semiconductor Package Including a Dummy Pad
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115812902023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites