Patents/Inventors

Seunghoon Yeon

Suwon-siKR8 patents

10 Patents

US119904522024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119424462024
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118879132024
Integrated Circuit Device and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites
US118698182024
Chip-stacked Semiconductor Package and Method of Manufacturing Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118625962024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116263852023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115692012023
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US115520372023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115454172023
Integrated Circuit Device and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites
US115455122023
Image Sensor Package with Underfill and Image Sensor Module Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites