7 Patents
- US123410842025Integrated Circuit Device with Through-electrode and Electrode Landing Pad, and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US121675962024Three-dimensional Semiconductor Devices and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
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- US115520962023Three-dimensional Semiconductor Devices and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites