Patents/Inventors

Seunggeol Ryu

Suwon-siKR9 patents

7 Patents

US125641052026
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US125060472025
Semiconductor Package and Cooling System
Samsung Electronics Co., Ltd.
0 cites
US124314032025
Semiconductor Package Including Thermal Interface Material (TIM) Layers on Semiconductor Chips
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122438032025
Thermal Interface Material, Method of Manufacturing the Same, and Semiconductor Packages Including the Same
UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
0 cites
US122372682025
Integrated Circuit Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120093032024
Integrated Circuit Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119358122024
Thermal Interface Material and Semiconductor Packages Including the Same
UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
0 cites