Patents/Inventors

Seungduk Baek

Hwaseong-siKR6 patents

8 Patents

US124380642025
Semiconductor Package with Bonding Interface
Samsung Electronics Co., Ltd.
0 cites
US123681192025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123478192025
Semiconductor Package Having Stacked Semiconductor Chips
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121548812024
Integrated Circuit Device Having Redistribution Pattern
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121257532024
Semiconductor Package Including Test Bumps
Samsung Electronics Co., Ltd.
0 cites
US117216012023
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117216042023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116409512023
Integrated Circuit Device Having Redistribution Pattern
SAMSUNG ELECTRONICS CO., Ltd.
0 cites