Seung Nam Son

5 Patents

• US123880182025

  Device Chip Scale Package Including a Protective Layer and Method of Manufacturing a Device Chip Scale Package

  Amkor Technology Singapore Holding Pte. Ltd.

  0 cites
• US119904112024

  Device Chip Scale Package Including a Protective Layer

  Amkor Technology Singapore Holding Pte. Ltd.

  0 cites
• US119488082024

  Semiconductor Device and Manufacturing Method Thereof

  AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. Ltd.

  0 cites
• US119087612024

  Electronic Devices with a Redistribution Layer and Methods of Manufacturing Electronic Devices with a Redistribution Layer

  Amkor Technology Singapore Holding Pte. Ltd.

  0 cites
• US115629362023

  Electrionic Devices with Interposer and Redistribution Layer

  Amkor Technology Singapore Holding Pte. Ltd.

  0 cites