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Seung-kwan Ryu
Suwon-si
KR
5 patents
5 Patents
US12543605
2026
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US12424561
2025
Semiconductor Package Including Interposer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US11996366
2024
Semiconductor Package Including Interposer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US11705391
2023
Interposer and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites
US11676902
2023
Semiconductor Package Including Interposer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites