Patents/Inventors

Setsuya Iwashita

NirasakiJP2 patents

3 Patents

US124790212025
Thixomolding Material and Method of Manufacturing Thixomolding Material
SEIKO EPSON CORPORATION
0 cites
US123114372025
Thixomolding Material
SEIKO EPSON CORPORATION
0 cites
US118783452024
Thixomolding Material
SEIKO EPSON CORPORATION
0 cites