Patents/Inventors

Setsuo Kikuchi

AichiJP2 patents

2 Patents

US121521472024
Thermally Conductive Silicone Gel Composition
Fuji Polymer Industries Co., Ltd.
0 cites
US116435542023
Composite Resin Granules and Method for Producing the Same, and Thermally Conductive Resin Molded Body Using Composite Resin Granules and Method for Producing Thermally Conductive Resin Molded Body
Fuji Polymer Industries Co., Ltd.
0 cites