6 Patents
- 0 cites
- US123344532025Soldered Metallic Reservoirs for Enhanced Transient and Steady-state Thermal Performance
Intel Corporation
0 cites - 0 cites
- US118814382024First-level Integration of Second-level Thermal Interface Material for Integrated Circuit Assemblies
Intel Corporation
0 cites - US117768642023Corner Guard for Improved Electroplated First Level Interconnect Bump Height Range
Intel Corporation
0 cites - US117768692023Package with a Highly Conductive Layer Deposited on Die Using Throughput Additive Deposition Prior to TIM1 Dispense
Intel Corporation
0 cites