Patents/Inventors

Sergio Antonio Chan Arguedas

Chandler, AZUS13 patents

13 Patents

US125884992026
Integrated Circuit Heat Spreader Including Sealant Interface Material
Intel Corporation
0 cites
US122726142025
Integrated Circuit Packages with Solder Thermal Interface Materials with Embedded Particles
Intel Corporation
0 cites
US122388922025
Immersion Cooling for Integrated Circuit Devices
Intel Corporation
0 cites
US122059152025
Microelectronic Package with Solder Array Thermal Interface Material (SA-TIM)
Intel Corporation
0 cites
US120806202024
Additively Manufactured Structures for Heat Dissipation from Integrated Circuit Devices
Intel Corporation
0 cites
US120625922024
Integrated Circuit Packages with Thermal Interface Materials with Different Material Compositions
Intel Corporation
0 cites
US119357992024
Integrated Circuit Package Lids with Polymer Features
Intel Corporation
0 cites
US118942822024
Vented Lids for Integrated Circuit Packages
Intel Corporation
0 cites
US118173692023
Lids for Integrated Circuit Packages with Solder Thermal Interface Materials
Intel Corporation
0 cites
US117988612023
Integrated Heat Spreader (IHS) with Heating Element
Intel Corporation
0 cites
US117912372023
Microelectronic Assemblies Including a Thermal Interface Material
Intel Corporation
0 cites
US117355522023
Microelectronic Package with Solder Array Thermal Interface Material (SA-TIM)
Intel Corporation
0 cites
US116826052023
Integrated Circuit Packages with Asymmetric Adhesion Material Regions
Intel Corporation
0 cites