5 Patents
- US126108512026Semiconductor Device and Method of Making a Dual-side Molded System-in-package with Fine-pitched Interconnects
STATS Chippac Pte. Ltd.
0 cites - US125521922026Selective Stencil Mask and a Stencil Printing Method0 cites
- US124126332025Flash Memory for Reducing Reliability Degradation of OS Data Due to SMT Process
Samsung Electronics Co., Ltd.
0 cites - US123083272025Semiconductor Device with Compartment Shield Formed from Metal Bars and Manufacturing Method Thereof
STATS Chippac Pte. Ltd.
0 cites - US119904212024Semiconductor Device with Compartment Shield Formed from Metal Bars and Manufacturing Method Thereof
STATS Chippac Pte. Ltd.
0 cites