Patents/Inventors

Seongho Shin

Suwon-siKR2 patents

2 Patents

US125327472026
Semiconductor Package and Package-on-package Having Different Wiring Insulating Layers Surrounding Differential Signal Wiring Layers
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118550132023
Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites