16 Patents
- US122625622025Image Sensor with Varying Depth Deep Trench Isolation Structure for Reduced Crosstalk
OMNIVISION TECHNOLOGIES, Inc.
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- US120877922024Suppressed Cross-talk Pixel-array Substrate and Fabrication Method
Omnivision Technologies, Inc.
0 cites - US119844642024CMOS Image Sensor Having Front Side and Back Side Trench Isolation Structures Enclosing Pixel Regions and a Capacitor for Storing the Image Charge
Omnivision Technologies, Inc.
0 cites - 0 cites
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- US118625092024Shallow Trench Isolation (STI) Structure for CMOS Image Sensor
Omnivision Technologies, Inc.
0 cites - US118109282023CMOS Image Sensor with LED Flickering Reduction and Low Color Cross-talk
OMNIVISION TECHNOLOGIES, Inc.
0 cites - US117054752023Method of Forming Shallow Trench Isolation (STI) Structure for Suppressing Dark Current
Omnivision Technologies, Inc.
0 cites - US117004642023Selective Nitrided Gate-oxide for RTS Noise and White-pixel Reduction
Omnivision Technologies, Inc.
0 cites - US116950302023Reduced Cross-talk Pixel-array Substrate and Fabrication Method
Omnivision Technologies, Inc.
0 cites - US116473002023Method for Forming LED Flickering Reduction (LFR) Film for HDR Image Sensor and Image Sensor Having Same
Omnivision Technologies, Inc.
0 cites - 0 cites
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- US115576202023Metal Grid Structure Integrated with Deep Trench Isolation Structure
Omnivision Technologies, Inc.
0 cites