Seong Hwan Park

6 Patents

• US125735602026

  Composite Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US125326972026

  Etching Device and Etching Method Thereof

  ZEUS CO., Ltd.

  0 cites
• US122609942025

  Composite Electronic Component with Electrode Using Epoxy

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US121835152024

  Ceramic Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US120133272024

  Flow Cell Device

  ZEUS ENP CO., Ltd.

  0 cites
• US116748752023

  Fluid Medium Monitoring Apparatus

  ZEUS ENP CO., Ltd.

  0 cites