Seokbeom Heo

2 Patents

• US126108512026

  Semiconductor Device and Method of Making a Dual-side Molded System-in-package with Fine-pitched Interconnects

  STATS Chippac Pte. Ltd.

  0 cites
• US125521922026

  Selective Stencil Mask and a Stencil Printing Method

  0 cites