Patents/Inventors

Seok Ling Lim

Kulim KedahMY27 patents

16 Patents

US126047472026
Opossum Redistribution Frame for Configurable Memory Devices
Intel Corporation
0 cites
US125990132026
Semiconductor Packages for Stacked Memory-on-package (SMOP) and Methods of Manufacturing the Same
INTEL CORPORATION
0 cites
US125885112026
Shielding Assembly for Semiconductor Packages
Intel Corporation
0 cites
US125001752025
Integrated Bridge Frame for Package Substrate
Intel Corporation
0 cites
US123288162025
Asymmetrical Laminated Circuit Boards for Improved Electrical Performance
Intel Corporation
0 cites
US122564872025
Hybrid Boards with Embedded Planes
Intel Corporation
0 cites
US122180642025
Molded Silicon Interconnects in Bridges for Integrated-circuit Packages
Intel Corporation
0 cites
US121912812025
Multi-chip Package with Recessed Memory
Intel Corporation
0 cites
US121837222024
Molded Interconnects in Bridges for Integrated-circuit Packages
Intel Corporation
0 cites
US121425702024
Composite Bridge Die-to-die Interconnects for Integrated-circuit Packages
Intel Corporation
0 cites
US120027472024
Integrated Bridge for Die-to-die Interconnects
Intel Corporation
0 cites
US119554312024
Interposer Structures and Methods for 2.5D and 3D Packaging
Intel Corporation
0 cites
US118879402024
Integrated Circuit Packages with Conductive Element Having Cavities Housing Electrically Connected Embedded Components
Intel Corporation
0 cites
US116769102023
Embedded Reference Layers for Semiconductor Package Substrates
Intel Corporation
0 cites
US115748772023
Semiconductor Miniaturization Through Component Placement on Stepped Stiffener
INTEL CORPORATION
0 cites
US115629542023
Frame-array Interconnects for Integrated-circuit Packages
Intel Corporation
0 cites