Seiji Shimabukuro

9 Patents

• US126044742026

  Trench Patterning Process Using Microcracking

  Sandisk Technologies, Inc.

  0 cites
• US124083452025

  Three-dimensional Memory Device with Backside Support Pillar Structures and Methods of Forming the Same

  Sandisk Technologies, Inc.

  0 cites
• US123826382025

  Three-dimensional Memory Device and Method of Making Thereof Using Double Pitch Word Line Formation

  Sandisk Technologies, Inc.

  0 cites
• US122133202025

  Three-dimensional Memory Device with Finned Support Pillar Structures and Methods for Forming the Same

  SANDISK TECHNOLOGIES LLC

  0 cites
• US120462852024

  Three-dimensional Memory Device and Method of Making Thereof Using Double Pitch Word Line Formation

  SANDISK TECHNOLOGIES LLC

  0 cites
• US119424292024

  Three-dimensional Memory Device and Method of Making Thereof Using Double Pitch Word Line Formation

  SANDISK TECHNOLOGIES LLC

  0 cites
• US118442222023

  Three-dimensional Memory Device with Backside Support Pillar Structures and Methods of Forming the Same

  SANDISK TECHNOLOGIES LLC

  0 cites
• US117027502023

  Method and Apparatus for Depositing a Multi-sector Film on Backside of a Semiconductor Wafer

  SANDISK TECHNOLOGIES LLC

  0 cites
• US116371182023

  Three-dimensional Memory Device Containing Auxiliary Support Pillar Structures and Method of Making the Same

  SANDISK TECHNOLOGIES LLC

  0 cites