Seiichi Suenaga

7 Patents

• US124314062025

  Bonded Body, Circuit Board, Semiconductor Device, and Method for Manufacturing Bonded Body

  TOSHIBA MATERIALS CO., Ltd.

  0 cites
• US123438202025

  Brazing Material, Bonded Body, Ceramic Circuit Board, and Method for Manufacturing Bonded Body

  TOSHIBA MATERIALS CO., Ltd.

  0 cites
• US123477442025

  Bonded Body Including Titanium Alloy at Bonding Boundary

  TOSHIBA MATERIALS CO., Ltd.

  0 cites
• US122402182025

  Bonded Assembly, and Ceramic Circuit Substrate and Semiconductor Device Using the Same

  TOSHIBA MATERIALS CO., Ltd.

  0 cites
• US121609592024

  Bonded Body, Ceramic Copper Circuit Board, Method for Manufacturing Bonded Body, and Method for Manufacturing Ceramic Copper Circuit Board

  TOSHIBA MATERIALS CO., Ltd.

  0 cites
• US121156032024

  Bonded Body, Ceramic Copper Circuit Substrate, and Semiconductor Device

  TOSHIBA MATERIALS CO., Ltd.

  0 cites
• US119489002024

  Bonded Body, Circuit Board, and Semiconductor Device

  TOSHIBA MATERIALS CO., Ltd.

  0 cites