See Hiong Leow

4 Patents

• US125819762026

  Wire Bonding Directly on Exposed Conductive Vias and Interconnects and Related Systems and Methods

  Micron Technology, Inc.

  0 cites
• US124762162025

  Wire Bonding for Stacked Memory Dies

  Micron Technology, Inc.

  0 cites
• US124631402025

  Flexible Interposer for Semiconductor Dies

  Micron Technology, Inc.

  0 cites
• US124128112025

  Split via Structure for Semiconductor Device Packaging

  Micron Technology, Inc.

  0 cites