Patents/Inventors

Se Woong Cha

Gwangju-siKR3 patents

4 Patents

US122551972025
Package-on-package Type Semiconductor Package
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. Ltd.
0 cites
US122306612025
Electronic Device Package and Fabricating Method Thereof
Amkor Technology Singapore Holding Pte. Ltd.
0 cites
US120339102024
Wafer-level Stack Chip Package and Method of Manufacturing the Same
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. Ltd.
0 cites
US119618672024
Electronic Device Package and Fabricating Method Thereof
Amkor Technology Singapore Holding Pte. Ltd.
0 cites