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Scott R. Lapree
Rochester, MN
US
1 patent
2 Patents
US11776876
2023
Distributing Heatsink Load Across a Processor Module with Separable Input/output (I/O) Connectors
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US11758664
2023
Processor Module Retention
International Business Machines Corporation
0 cites