Patents/Inventors

Scott M. Hayes

Chandler, AZUS32 patents

25 Patents

US126222802026
Semiconductor Device with Through Package via and Method Therefor
NXP USA, Inc.
0 cites
US126123062026
Die Stacking with Controlled Angular Alignment
Stmicroelectronics International N.V.
0 cites
US125990042026
Semiconductor Device with Active Mold Package and Method Therefor
NXP USA, Inc.
0 cites
US125899902026
Die Stacking with Controlled Tilt and Angular Alignment
Stmicroelectronics International N.V.
0 cites
US125885572026
Multichip Packages with 3D Integration
NXP USA, Inc.
0 cites
US125885172026
Semiconductor Device with Self-aligned Waveguide and Method Therefor
NXP USA, Inc.
0 cites
US125388442026
Double-sided Multichip Packages
NXP USA, Inc.
0 cites
US124697732025
Semiconductor Device with Attached Battery and Method Therefor
NXP USA, Inc.
0 cites
US124068962025
Semiconductor Device Package Having Thermal Dissipation Feature and Method Therefor
NXP USA, Inc.
0 cites
US123811642025
Semiconductor Device with Enclosed Cavity and Method Therefor
NXP USA, Inc.
0 cites
US122887662025
Semiconductor Device with Open Cavity and Method Therefor
NXP USA, Inc.
0 cites
US122438422025
Semiconductor Device with Open Cavity and Method Therefor
NXP USA, Inc.
0 cites
US121257162024
Semiconductor Device Packaging Warpage Control
NXP USA, Inc.
0 cites
US121193162024
Patterned and Planarized Under-bump Metallization
NXP USA, Inc.
0 cites
US120339502024
Semiconductor Device with Self-aligned Waveguide and Method Therefor
NXP USA, Inc.
0 cites
US119617762024
Semiconductor Device with Connector in Package and Method Therefor
NXP USA, Inc.
0 cites
US119358092024
Semiconductor Package Thermal Spreader Having Integrated EF/EMI Shielding and Antenna Elements
NXP USA, Inc.
0 cites
US118375602023
Semiconductor Device with Waveguide and Method Therefor
NXP USA, Inc.
0 cites
US118239682023
Semiconductor Device Package Having Stress Isolation and Method Therefor
NXP USA, Inc.
0 cites
US118173662023
Semiconductor Device Package Having Thermal Dissipation Feature and Method Therefor
NXP USA, Inc.
0 cites
US117912832023
Semiconductor Device Packaging Warpage Control
NXP USA, Inc.
0 cites
US117606232023
No-gel Pressure Sensor Package
NXP USA, Inc.
0 cites
US117282852023
Semiconductor Device Packaging Warpage Control
NXP USA, Inc.
0 cites
US115575252023
Semiconductor Package Thermal Spreader Having Integrated RF/EMI Shielding and Antenna Elements
NXP USA, Inc.
0 cites
US115575442023
Semiconductor Device Having a Translation Feature and Method Therefor
NXP USA, Inc.
0 cites