3 Patents
- US119844292024Leadless Power Amplifier Packages Including Topside Termination Interposer Arrangements and Methods for the Fabrication Thereof
NXP USA, Inc.
0 cites - US116212312023Methods of Fabricating Leadless Power Amplifier Packages Including Topside Terminations
NXP USA, Inc.
0 cites - US116216732023Power Amplifier Packages and Systems Incorporating Design-flexible Package Platforms
NXP USA, Inc.
0 cites