Patents/Inventors

Scott Christopher Pollard

Big Flats, NYUS7 patents

7 Patents

US122074052025
Beveled Overburden for Vias and Method of Making the Same
Corning Incorporated
0 cites
US122008752025
Copper Metallization for Through-glass Vias on Thin Glass
Industrial Technology Research Institute
0 cites
US121319852024
Hermetic Metallized via with Improved Reliability
Corning Incorporated
0 cites
US119534622024
Glass Electrochemical Sensor with Wafer Level Stacking and Through Glass via (TGV) Interconnects
Corning Incorporated
0 cites
US117093972023
Backlight Including Patterned Reflectors, Diffuser Plate, and Method for Fabricating the Backlight
Corning Incorporated
0 cites
US116642852023
Electronic Packages Including Structured Glass Articles and Methods for Making the Same
CORNING INCORPORATED
0 cites
US116300762023
Glass Electrochemical Sensor with Wafer Level Stacking and Through Glass via (TGV) Interconnects
Corning Incorporated
0 cites