16 Patents
- 0 cites
- US125989772026Fill of Vias in Single and Dual Damascene Structures Using Self-assembled Monolayer
Intel Corporation
0 cites - 0 cites
- 0 cites
- 0 cites
- US125001622025Staggered Vertically Spaced Integrated Circuit Line Metallization with Differential Vias and Metal-selective Deposition
Intel Corporation
0 cites - 0 cites
- 0 cites
- 0 cites
- US121837392024Ribbon or Wire Transistor Stack with Selective Dipole Threshold Voltage Shifter
Intel Corporation
0 cites - 0 cites
- 0 cites
- 0 cites
- 0 cites
- 0 cites
- 0 cites