Patents/Inventors

Scott B. Charles

Spring Valley, WIUS1 patent

2 Patents

US124043862025
Cured Epoxy Resin Composition Suitable for Electronic Device Enclosure, Articles, and Methods
3M Innovative Properties Company
0 cites
US117732542023
Cured Epoxy Resin Composition Suitable for Electronic Device Enclosure, Articles, and Methods
3M Innovative Properties Company
0 cites