Patents/Inventors

Sayaka Wakioka

OsakaJP2 patents

3 Patents

US121395762024
Curable Resin Composition, Adhesive Agent, Adhesive Film, Circuit Substrate, Interlayer Insulating Material, and Printed Wiring Board
SEKISUI CHEMICAL CO., Ltd.
0 cites
US118021772023
Curable Resin Composition, Adhesive, Imide Oligomer, Imide Oligomer Composition, and Curing Agent
SEKISUI CHEMICAL CO., Ltd.
0 cites
US117534992023
Curable Resin Composition, Adhesive, Imide Oligomer, Imide Oligomer Composition, and Curing Agent
SEKISUI CHEMICAL CO., Ltd.
0 cites