Satyendra Singh Chauhan

5 Patents

• US125750252026

  Stress Relief Structure for Flip-chip Packaged Devices

  TEXAS INSTRUMENTS INCORPORATED

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• US119305902024

  Stress Relief for Flip-chip Packaged Devices

  TEXAS INSTRUMENTS INCORPORATED

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• US119087802024

  Semiconductor Package with Solder Standoff

  TEXAS INSTRUMENTS INCORPORATED

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• US116581302023

  Conductive Plate Stress Reduction Feature

  TEXAS INSTRUMENTS INCORPORATED

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• US115577222023

  Hall-effect Sensor Package with Added Current Path

  TEXAS INSTRUMENTS INCORPORATED

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