Patents/Inventors

Satohiko Hoshino

Albany, NYUS11 patents

5 Patents

US126223362026
Bonding Layer and Process
Tokyo Electron Limited
0 cites
US126108452026
Method for Forming Semiconductor Packages Using Dielectric Alignment Marks and Laser Liftoff Process
Tokyo Electron Limited
0 cites
US125776652026
Next Generation Bonding Layer for 3D Heterogeneous Integration
Tokyo Electron Limited
0 cites
US125820172026
Bonding Layer and Process
Tokyo Electron Limited
0 cites
US121258182024
Technologies for Plasma Oxidation Protection During Hybrid Bonding of Semiconductor Devices
Tokyo Electron Limited
0 cites