5 Patents
- US125819682026Package Architecture of Large Dies Using Quasi-monolithic Chip Layers
Intel Corporation
0 cites - US124069622025Power Delivery Through Capacitor-dies in a Multi-layered Microelectronic Assembly
Intel Corporation
0 cites - US123157942025Skip Level Vias in Metallization Layers for Integrated Circuit Devices
Intel Corporation
0 cites - US122887462025Skip Level Vias in Metallization Layers for Integrated Circuit Devices
Intel Corporation
0 cites - 0 cites