8 Patents
- US125423582026Microelectronic Devices Designed with Mold Patterning to Create Package-level Components for High Frequency Communication Systems
Intel Corporation
0 cites - 0 cites
- 0 cites
- US121551332024Microelectronic Devices Designed with Mold Patterning to Create Package-level Components for High Frequency Communication Systems
Intel Corporation
0 cites - 0 cites
- US116584182023Microelectronic Devices Designed with Mold Patterning to Create Package-level Components for High Frequency Communication Systems
Intel Corporation
0 cites - US115757492023Low-weight Single Mm-wave Dielectric Waveguide Interconnect Architecture in Autonomous Cars
Intel Corporation
0 cites - 0 cites