Saquib B. Halim

3 Patents

• US119076232024

  Chip Module Structure and Method and System for Chip Module Design Using Chip-package Co-optimization

  Globalfoundries Dresden Module One Limited Liability Company & Co. KG

  0 cites
• US118550052023

  Crackstop with Embedded Passive Radio Frequency Noise Suppressor and Method

  Globalfoundries U.S. Inc.

  0 cites
• US118044402023

  Chip Module with Robust In-package Interconnects

  GLOBALFOUNDRIES U.S. Inc.

  0 cites