Patents/Inventors

Sanka Ganesan

Chandler, AZUS24 patents

24 Patents

US125576752026
Inorganic Redistribution Layer on Organic Substrate in Integrated Circuit Packages
Intel Corporation
0 cites
US124761742025
Ultra-thin, Hyper-density Semiconductor Packages
Intel Corporation
0 cites
US124069142025
Ultra-thin, Hyper-density Semiconductor Packages
Intel Corporation
0 cites
US123879992025
Planar Integrated Circuit Package Interconnects
Intel Corporation
0 cites
US123680892025
Low Cost Embedded Integrated Circuit Dies
Intel Corporation
0 cites
US123477822025
Microelectronic Assemblies with Direct Attach to Circuit Boards
Intel Corporation
0 cites
US123342422025
Coreless Electronic Substrates Having Embedded Inductors
Intel Corporation
0 cites
US122611242025
Embedded Die Architecture and Method of Making
Intel Corporation
0 cites
US122242452025
Embedded Die Architecture and Method of Making
Intel Corporation
0 cites
US121762922024
Microelectronic Component Having Molded Regions with Through-mold Vias
Intel Corporation
0 cites
US121702732024
Integrated Circuit Assemblies with Direct Chip Attach to Circuit Boards
Intel Corporation
0 cites
US121425682024
Multi-die Ultrafine Pitch Patch Architecture of Interconnect Bridge Over Glass Layer and Method of Making
Intel Corporation
0 cites
US119787272024
Package on Active Silicon Semiconductor Packages
Intel Corporation
0 cites
US118698422024
Scalable High Speed High Bandwidth IO Signaling Package Architecture and Method of Making
Intel Corporation
0 cites
US118173902023
Microelectronic Component Having Molded Regions with Through-mold Vias
Intel Corporation
0 cites
US118044262023
Integrated Circuit Structures in Package Substrates
Intel Corporation
0 cites
US117568892023
Ultrathin Bridge and Multi-die Ultrafine Pitch Patch Architecture and Method of Making
Intel Corporation
0 cites
US116949592023
Multi-die Ultrafine Pitch Patch Architecture and Method of Making
Intel Corporation
0 cites
US116409422023
Microelectronic Component Having Molded Regions with Through-mold Vias
Intel Corporation
0 cites
US115812872023
Chip Scale Thin 3D Die Stacked Package
Intel Corporation
0 cites
US115748512023
Coupled Cooling Fins in Ultra-small Systems
Intel Corporation
0 cites
US115520352023
Electronic Package with Stud Bump Electrical Connections
Intel Corporation
0 cites
US115454072023
Thermal Management Solutions for Integrated Circuit Packages
Intel Corporation
0 cites
US115454412023
Semiconductor Package Having Wafer-level Active Die and External Die Mount
Intel Corporation
0 cites