4 Patents
- US123344142025Power Semiconductor Device with Dual Heat Dissipation Structures
Infineon Technologies AG
0 cites - US120682132024Chip Package and Semiconductor Arrangement Having Thermally Conductive Material in Contact with a Semiconductor Chip and Methods of Forming Thereof
Infineon Technologies AG
0 cites - US119087712024Power Semiconductor Device with Dual Heat Dissipation Structures
Infineon Technologies AG
0 cites - US116212042023Molded Semiconductor Module Having a Mold Step for Increasing Creepage Distance
Infineon Technologies AG
0 cites