27 Patents
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- US124069192025Stack of Horizontally Extending and Vertically Overlapping Features, Methods of Forming Circuitry Components, and Methods of Forming an Array of Memory Cells
Micron Technology, Inc.
0 cites - US123241432025Methods of Utilizing Etch-stop Material During Fabrication of Capacitors, Integrated Assemblies Comprising Capacitors
Micron Technology, Inc.
0 cites - US122848052025String Driver Assemblies Including Two-dimensional Materials, and Related Memory Devices
Lodestar Licensing Group LLC
0 cites - US122197582025Integrated Assemblies Having Transistor Body Regions Coupled to Carrier-sink-structures; and Methods of Forming Integrated Assemblies
Micron Technology, Inc.
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- US121502922024Integrated Assemblies Having Voids Along Regions of Gates, and Methods of Forming Conductive Structures
Micron Technology, Inc.
0 cites - US121426802024Transistor Structures Having Conductive Structures Along Pillars of Semiconductor Material
Micron Technology, Inc.
0 cites - US120698522024Methods of Forming Integrated Assemblies Having Conductive Material Along Sidewall Surfaces of Semiconductor Pillars
Micron Technology, Inc.
0 cites - US119232892024Stack of Horizontally Extending and Vertically Overlapping Features, Methods of Forming Circuitry Components, and Methods of Forming an Array of Memory Cells
Micron Technology, Inc.
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- US119105972024Integrated Assemblies Having Transistor Body Regions Coupled to Carrier-sink-structures; and Methods of Forming Integrated Assemblies
Micron Technology, Inc.
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- US117440612023Array of Capacitors, an Array of Memory Cells, a Method of Forming an Array of Capacitors, and a Method of Forming an Array of Memory Cells
Micron Technology, Inc.
0 cites - US117069092023Integrated Assemblies Comprising Memory Cells and Shielding Material Between the Memory Cells
Micron Technology, Inc.
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- US116005352023Integrated Assemblies Having Conductive Material Along Three of Four Sides Around Active Regions, and Methods of Forming Integrated Assemblies
Micron Technology, Inc.
0 cites - US115813172023Integrated Assemblies Having Shield Lines Between Digit Lines, and Methods of Forming Integrated Assemblies
Micron Technology, Inc.
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- US115692662023Integrated Structures Comprising Vertical Channel Material and Having Conductively-doped Semiconductor Material Directly Against Lower Sidewalls of the Channel Material
Micron Technology, Inc.
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