7 Patents
- US122305762025Chip-on-film Package and Display Apparatus Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US121483372024Chip on Film Package with Trench to Reduce Slippage and Display Device Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- 0 cites
- US118698182024Chip-stacked Semiconductor Package and Method of Manufacturing Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US118429452023Chip on Film Package and Display Apparatus Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites