Patents/Inventors

Sangsu Ha

DaejeonKR2 patents

3 Patents

US124597702025
Auto Splicing Device and Auto Splicing Method for Electrode
LG Energy Solution, Ltd.
0 cites
US117841392023
Package Substrate and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117496302023
Interconnect Structure and Semiconductor Chip Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites