Patents/Inventors

Sangkyu Lee

Suwon-siKR23 patents

24 Patents

US125754182026
Semiconductor Packages Having Organic Material Layer Between Through-via Structure and Encapsulant That Surrounds a Portion of Semiconductor Chip
Samsung Electronics Co., Ltd.
0 cites
US125001302025
Method of Manufacture of Fan-out Type Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US124631252025
Semiconductor Package Including Post
Samsung Electronics Co., Ltd.
0 cites
US124531072025
Semiconductor Device and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122077812025
Cleaner
LG ELECTRONICS Inc.
0 cites
US122077832025
Cleaner
LG ELECTRONICS Inc.
0 cites
US121796072024
Integrated Power Supply of Vehicle and Control Method Thereof
KIA CORPORATION
0 cites
US121836942024
Semiconductor Package Including Antenna
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121548732024
Semiconductor Package Including Antenna
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121304022024
Core Electrodes Based on Multiple Rod, and Underwater Electric Field Sensor Electrodes and Underwater Electric Field Sensor Having the Same
AGENCY FOR DEFENSE DEVELOPMENT
0 cites
US120402482024
Semiconductor Package Including Heat Spreader Layer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120402992024
Semiconductor Package and Method of Manufacturing the Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119700812024
Battery Charging Apparatus and Method for Vehicle
Kia Motors Corporation
0 cites
US119730422024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US119424342024
Method of Manufacturing a Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US119358492024
Semiconductor Package with an Antenna Substrate
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119278352024
Functional Contact Lens and Manufacturing Method Therefor
GRAPHENE SQUARE Inc.
0 cites
US119190752024
Method for Manufacturing Oxide Dispersion Strengthened Alloy Using Organic/inorganic Mixed Composition as Raw Material
0 cites
US118469372023
Autonomous Cleaner
LG ELECTRONICS Inc.
0 cites
US117355532023
Semiconductor Package and Method of Manufacturing the Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116370792023
Semiconductor Package Including Antenna
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115695632023
Semiconductor Packages and Method of Manufacturing Semiconductor Packages
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115629392023
Semiconductor Package Including Heat Spreader Layer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115472632023
Autonomous Cleaner
LG ELECTRONICS Inc.
0 cites