Patents/Inventors

Sangcheon Park

Suwon-siKR12 patents

11 Patents

US125388482026
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123277842025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US122666382025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US121320192024
Packaged Multi-chip Semiconductor Devices and Methods of Fabricating Same
Samsung Electronics Co., Ltd.
0 cites
US120948672024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120806912024
Semiconductor Devices
Samsung Electronics Co., Ltd.
0 cites
US118240452023
Semiconductor Package and Method of Manufacturing the Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US117496622023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116581412023
Die-to-wafer Bonding Structure and Semiconductor Package Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116212472023
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US115520332023
Packaged Multi-chip Semiconductor Devices and Methods of Fabricating Same
Samsung Electronics Co., Ltd.
0 cites