Sang-sick Park

9 Patents

• US124698102025

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US121837182024

  Semiconductor Package Having a High Reliability

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US121130502024

  Semiconductor Package with Increased Thermal Radiation Efficiency

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US120741422024

  Semiconductor Package and Method of Fabricating the Same

  Samsung Electronics Co., Ltd.

  0 cites
• US119489032024

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US119013392024

  Semiconductor Package Including a Fillet Layer

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US118943462024

  Semiconductor Package Having a High Reliability

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US116643522023

  Semiconductor Package Having a High Reliability

  Samsung Electronics Co., Ltd.

  0 cites
• US116160392023

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites