8 Patents
- 0 cites
- US124530542025Cooling Assembly with Strap Element to Diminish Lateral Movement of Cooling Mass During Installation of the Cooling Mass
Intel Corporation
0 cites - 0 cites
- 0 cites
- US123099662025Thermally Conductive Chamber with Stiffening Structure for Thermal Cooling Assembly of Semiconductor Chip Package Under High Loading Force
Intel Corporation
0 cites - US121319772024Electronic Systems with Inverted Circuit Board with Heat Sink to Chassis Attachment
Intel Corporation
0 cites - US118429432023Electronic Systems with Inverted Circuit Board with Heat Sink to Chassis Attachment
INTEL CORPORATION
0 cites - US115438682023Apparatus and Method to Provide a Thermal Parameter Report for a Multi-chip Package
Intel Corporation
0 cites