3 Patents
- US121486902024Microelectronic Devices Having Air Gap Structures Integrated with Interconnect for Reduced Parasitic Capacitances
Tahoe Research, Ltd.
0 cites - US116317372023Ingaas Epi Structure and Wet Etch Process for Enabling Iii-v GAA in Art Trench
Intel Corporation
0 cites - US115878622023Microelectronic Devices Having Air Gap Structures Integrated with Interconnect for Reduced Parasitic Capacitances
Tahoe Research, Ltd.
0 cites