3 Patents
- US120210462024Redistribution Layer and Integrated Circuit Including Redistribution Layer
STMICROELECTRONICS S.r.l.
0 cites - 0 cites
- US115878662023Integrated Electronic Device with a Redistribution Region and a High Resilience to Mechanical Stresses and Method for Its Preparation
STMICROELECTRONICS S.r.l.
0 cites