Sameer A. Deshpande

3 Patents

• US126105872026

  Backside Power Rail to Deep Vias

  Applied Materials, Inc.

  0 cites
• US125573432026

  Method of Ultra Thinning of Wafer

  Applied Materials, Inc.

  0 cites
• US124955822025

  Self-aligned Wide Backside Power Rail Contacts to Multiple Transistor Sources

  Applied Materials, Inc.

  0 cites