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Inventors
Salman Akram
Boise, ID
US
1 patent
2 Patents
US11721788
2023
Method of Bonding a Semiconductor Device to a Support Substrate
Lumileds LLC
0 cites
US11664396
2023
Elevated Pocket Pixels, Imaging Devices and Systems Including the Same and Method of Forming the Same
Micron Technology, Inc.
0 cites